Using the multi-metal processing cooling module, the upper cover is integrally forged and grooves are made with precise CNC technology. The inside is made with a top-notch aluminum extrusion process and anode coloring. The outside is punch pressed with round holes to increase the cooling effect.
The use of the latest JEDEC RC 2.0 circuit board can increase the speed of the transmitting signal. It completely releases the transmission of the memory module and offers gamers the ultimate sensation of overclocking and a highly stable overclocking memory module.
TEAMGROUP insists on using OEM IC chips that pass various rigorous internal tests. Its high reliability makes gamers feel at ease.
T-FORCE is TEAM force. The red “T” on the logo of “TF” represents TEAMGROUP’s passion for the storage products. The black “F” represents TEAMGROUP’s over 18 years of promotion of storage products. The visual design of the perfect combination elegantly symbolizes a pair of flying wings. They represent that the high quality and extreme performance gaming products from TEAMGROUP are capable of allowing all gamers to break the speed limit and enjoy the ever-changing world of gaming.
288 Pin Unbuffered DIMM Non ECC
4GBx2 / 8GBx2
|Data Transfer Bandwidth||24,000 MB/s
|Dimensions||45(H) x 134(L) x 8(W)mm|
|Heat Spreader||Aluminum heat spreader|